X-Ray test is the use of X-ray penetration to detect the internal structure of the IC and lead imaging effect, which is a non-destructive test. It is mainly through X-ray irradiation imaging, check the hardware components inside the components, mainly check the chip pin frame, wafer size, gold wire binding diagram, ESD holes and damage and other information. Customers can provide gold samples (good products) for comparative testing according to actual needs.

Scope of application of X-Ray detection:

First, auxiliary IC authenticity verification.

Second, auxiliary IC or device failure cause analysis

1. Defect inspection in IC package (integrity inspection of layer stripping, burst, cavity and wiring)

2. Defects that may occur in the printed circuit board manufacturing process (poor alignment or bridge and open circuit)

3. Detection and measurement of SMT solder joint voids

4. Defects inspection of open circuit, short circuit or abnormal connection that may occur in various connection lines

5. Integrity inspection of tin balls in tin ball array package and chip encapsulation

6. Inspection of high density plastic material rupture or metal material cavity

7. Chip size measurement, line arc measurement, component tin area ratio measurement.

Third, the surface of the thick metal sheet can not be detected.

X-Ray test auxiliary IC authenticity verification case:

Gold sample (good product) comparison test case