The solderability test mainly simulates the tin eating ability of the pin, so as to detect whether the tin loading ability of the chip pin is up to the standard. This test is generally used to make a qualitative and quantitative assessment of the weldability of components, printed circuit boards, solders and fluxes. In the assembly and welding process of electronic products, the welding quality will directly affect the quality of the whole machine and the reliability of the whole system. Therefore, in order to avoid adverse phenomena caused by welding quality problems, in addition to strict control of process parameters to improve welding quality, it is also necessary to carry out scientific weldability tests on printed circuit boards and electronic components. This test can very well assist the technical engineers in the manufacturing industry to improve product quality and zero defect welding process.

Test Case:

Function and significance of weldability test:

In the assembly and welding process of electronic products, if the poor choice of circuit board, component solderable end or solder paste, flux quality may cause welding problems, which directly affect the quality of the product. General welding problems such as: poor wetting, bridging, cracking, etc., these will increase the quality control workload and produce a lot of maintenance, causing unnecessary losses, such as false welding, virtual welding and poor welding strength, will directly lead to reliability problems. Weldability testing can better avoid such risks. Usually, the weldability test of incoming materials is carried out to quantitatively evaluate the weldability of tested samples, and reasonable data support is provided to directly determine whether incoming materials can be put into production or can be put into production after adjustment of process window. For the batch of components, the solderability test is more necessary because the storage time is longer, the storage time is longer leading to slight oxidation, or the production is smaller leading to long storage time. The solderability evaluation can be carried out before the use of the components to determine whether the use of the batch of components will lead to welding quality problems, so as to avoid the risks caused by such problems.