The open-cover test (unsealing) is mainly to use relevant instruments and equipment to cut and corrode the IC surface package, combined with the metallographic microscope to observe whether there is a wafer inside the IC, whether the structure, size, font and logo of the wafer are consistent with the original sample, and whether there is EOS/ESD breakdown.

The test is usually used to verify the authenticity of the chip and analyze the failure cause of the chip

Note: Open cap test (DECAP), a destructive experiment, usually uses laser etching and chemical corrosion methods to remove the outer package shell of the component, so as to better observe the structure, size, font, logo and other information of the wafer inside the device, and assist the verification of chip authenticity and the analysis of the cause of chip failure.

Case presentation:

Now our lab can handle almost all forms of IC packaging DECAP, if you have related needs, you can contact our customer service staff.